Pricing
Pricing is based on the number of sides, order quantity, technology, and delivery. Boards can be stepped into arrays for more economical pricing. Prices based on standard smd technology and are subject to change based on design. Prices do not include shipping or stencil
incoming frieght. See RFQ Notes below for additional specifications.
RFQ Notes
- Soldermask design conforms to requirements
- Minimum leaded pitch size = .020 (0.5mm)
- Minimum BGA pitch size .030 (1.0mm)
- Piece size <= 8.00 x 10.00
- .125 Tooling holes on boards or in rails
- Board thickness .062
- <= 10 Images per array
- No Via in Pad (VIP) Technology
- Stencil Gerber files provided 1:1
- Prices do not include re-work for bare board defects.
- Rework must be approved in writing. (e-mail accepted)
- Standard lead time; (Expedited Deliveries Available)
- 1-20 pcs 2 days
- 21-50 pcs 2-3 days
- > 50 pcs 2-4 days
SIPAD LF, Lead Free SIPAD ssd
- Notify SIPAD Systems as early as possible for lead free SIPAD
- Add 20% to unit price for lead free SIPAD ssd
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