Products

The SIPAD process is offered in a few different varieties. Regular SIPAD ssd is eutectic 63/37 tin lead solder deposits. This is the original version and can use any eutectic solder paste as long as it is a water soluble version. SIPAD boards must be washed before flattening. Tin/Silver/Lead blends are also available for harsher environments but must be special ordered.

Regular SIPAD

The SIPAD solid solder deposit process is an alternative to screen printing solder paste during the printed circuit board assembly process. SIPAD solder is "solid solder" with adhesive flux to hold components in place.
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SIPAD LF

SIPAD LF is our lead free version of the SIPAD solid solder deposit. This product is excellent for the transition from leaded to lead free products. Like regular SIPAD boards, SIPAD LF boards come out of the box ready to place parts without stencil printing.
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SIPAD MW

SIPAD MW stands for microwave. These boards break all the soldermask rules for SIPAD ssd application however, microwave designs are becoming more and more popular with SIPAD Systems. Creative fixturing allows SIPAD systems to tackle these unusual designs previously thought impossible for the SIPAD solid solder deposit technology.
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SIPAD RF

SIPAD Radio Frequency (RF) boards do not follow traditional solder mask design rules. However, the advantages are numerous putting the right amount of solder in the right place. Careful stencil engineering and experience are the keys and SIPAD Systems offers both.
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SIPAD VIP

SIPAD VIP is via in pad technology. SIPAD Systems has developed different solutions for filling via holes with solder. Size, design and other factors affect which process is used. Please contact SIPAD Systems for more information on SIPAD VIP
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Make sure to check out the SIPAD Soldermask Requirements to learn more about the design and application of SIPAD boards.

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